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The keyword for achieving next-generation technology is miniaturization.Our company has developed a technology using general-purpose plastic molding that enables the formation of nano- and micro-level intricate shapes. This technology brings about significant improvements in characteristics that were previously considered impossible, along with cost advantages. It will lead to the practical implementation of next-generation sensors, displays, and medical devices.
Basic Information
Company Name TONO FINE PLATING Co., Ltd.
Company Address
2-1-6 Sengen, Tsukuba-shi, Ibaraki Prefecture
Industry Category
Semiconductor related/Materials & Equipment
Date of Establishment
2009
Number of Employees
4
Amount of Capital
NT$ 1,650,223
Summary of Capability
Service Mode
The patented technology HPA-Die® integrates mold structure utilizing special coatings molding techniquesmold-making techniques enabling mass production of patterns down to a minimum of 100nm through resin injection molding. HPA-Die® is a groundbreaking technology that achieves the transfer of intricate shapes by meticulously controlling the heat flow on the mold surface to obtain high resin fluidity.
Main Products
Development of Technology
Development of injection molding technologysurface treatment processing technology Production of molded products (HPA-Die®)coating services (DLC)
International Recognition
